Li, Y.; Shuai, M.; Zhang, J.; Zheng, H.; Sun, T.; Yang, Y.
Molecular Dynamics Investigation of Residual Stress and Surface Roughness of Cerium under Diamond Cutting. Micromachines 2018, 9, 386.
https://doi.org/10.3390/mi9080386
AMA Style
Li Y, Shuai M, Zhang J, Zheng H, Sun T, Yang Y.
Molecular Dynamics Investigation of Residual Stress and Surface Roughness of Cerium under Diamond Cutting. Micromachines. 2018; 9(8):386.
https://doi.org/10.3390/mi9080386
Chicago/Turabian Style
Li, Yao, Maobing Shuai, Junjie Zhang, Haibing Zheng, Tao Sun, and Yang Yang.
2018. "Molecular Dynamics Investigation of Residual Stress and Surface Roughness of Cerium under Diamond Cutting" Micromachines 9, no. 8: 386.
https://doi.org/10.3390/mi9080386
APA Style
Li, Y., Shuai, M., Zhang, J., Zheng, H., Sun, T., & Yang, Y.
(2018). Molecular Dynamics Investigation of Residual Stress and Surface Roughness of Cerium under Diamond Cutting. Micromachines, 9(8), 386.
https://doi.org/10.3390/mi9080386