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Journal: Micromachines, 2018
Volume: 9
Number: 93

Article: Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer
Authors: by Zhuhao Gong, Yulong Zhang, Xin Guo and Zewen Liu
Link: https://www.mdpi.com/2072-666X/9/3/93

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