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Micromachines 2016, 7(11), 210;

One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

1,2,3,* , 1
Institute of Solid Mechanics, Beihang University (BUAA), Beijing 100191, China
Key Laboratory of Soft Machines and Smart Devices of Zhejiang Province, Zhejiang University, Hangzhou 310027, China
State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China
School of Aerospace Engineering, Shenyang Aerospace University, Shenyang 110136, China
Department of Engineering Mechanics and Soft Matter Research Center, Zhejiang University, Hangzhou 310027, China
Authors to whom correspondence should be addressed.
Academic Editors: Seung Hwan Ko, Daeho Lee and Zhigang Wu
Received: 3 September 2016 / Revised: 8 November 2016 / Accepted: 14 November 2016 / Published: 18 November 2016
(This article belongs to the Special Issue Flexible and Stretchable Electronics)
Full-Text   |   PDF [1554 KB, uploaded 18 November 2016]   |  


A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed to validate the analytic model through the comparison of temperature distributions in the system. The influences of geometric and loading parameters on the temperature increase under a pulsed power are investigated. It is shown that a small duty cycle can reduce the temperature increase of the system effectively. A thin substrate can reduce the device temperature but increase the skin surface temperature. The results presented may be helpful to optimize the design of flexible electronic devices to reduce the adverse thermal influences in bio-integrated applications. View Full-Text
Keywords: flexible electronics; thermal analysis; human skin flexible electronics; thermal analysis; human skin

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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Cui, Y.; Li, Y.; Xing, Y.; Yang, T.; Song, J. One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin. Micromachines 2016, 7, 210.

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