Fukushima, T.; Hashiguchi, H.; Yonekura, H.; Kino, H.; Murugesan, M.; Bea, J.-C.; Lee, K.-W.; Tanaka, T.; Koyanagi, M.
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines 2016, 7, 184.
https://doi.org/10.3390/mi7100184
AMA Style
Fukushima T, Hashiguchi H, Yonekura H, Kino H, Murugesan M, Bea J-C, Lee K-W, Tanaka T, Koyanagi M.
Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines. 2016; 7(10):184.
https://doi.org/10.3390/mi7100184
Chicago/Turabian Style
Fukushima, Takafumi, Hideto Hashiguchi, Hiroshi Yonekura, Hisashi Kino, Mariappan Murugesan, Ji-Chel Bea, Kang-Wook Lee, Tetsu Tanaka, and Mitsumasa Koyanagi.
2016. "Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration" Micromachines 7, no. 10: 184.
https://doi.org/10.3390/mi7100184
APA Style
Fukushima, T., Hashiguchi, H., Yonekura, H., Kino, H., Murugesan, M., Bea, J.-C., Lee, K.-W., Tanaka, T., & Koyanagi, M.
(2016). Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. Micromachines, 7(10), 184.
https://doi.org/10.3390/mi7100184