Tang, W.-X.; Mai, C.-J.; Zhou, L.-Y.; Sun, Y.; Zhao, X.-R.; Liu, S.-L.; Wang, G.; Wang, D.-W.; Wang, C.-Q.
HBM Package Interconnection Pseudo All-Channel Signal Integrity Simulation and Implementation Method of the Synchronous Current Load Research. Micromachines 2025, 16, 896.
https://doi.org/10.3390/mi16080896
AMA Style
Tang W-X, Mai C-J, Zhou L-Y, Sun Y, Zhao X-R, Liu S-L, Wang G, Wang D-W, Wang C-Q.
HBM Package Interconnection Pseudo All-Channel Signal Integrity Simulation and Implementation Method of the Synchronous Current Load Research. Micromachines. 2025; 16(8):896.
https://doi.org/10.3390/mi16080896
Chicago/Turabian Style
Tang, Wen-Xue, Cong-Jian Mai, Li-Yan Zhou, Ying Sun, Xin-Ran Zhao, Shu-Li Liu, Gang Wang, Da-Wei Wang, and Cheng-Qian Wang.
2025. "HBM Package Interconnection Pseudo All-Channel Signal Integrity Simulation and Implementation Method of the Synchronous Current Load Research" Micromachines 16, no. 8: 896.
https://doi.org/10.3390/mi16080896
APA Style
Tang, W.-X., Mai, C.-J., Zhou, L.-Y., Sun, Y., Zhao, X.-R., Liu, S.-L., Wang, G., Wang, D.-W., & Wang, C.-Q.
(2025). HBM Package Interconnection Pseudo All-Channel Signal Integrity Simulation and Implementation Method of the Synchronous Current Load Research. Micromachines, 16(8), 896.
https://doi.org/10.3390/mi16080896
