Park, M.; Yoo, B.; Hong, M.; Cho, D.; Jeong, Y.; Park, C.; Kim, J.; Ha, T.-M.; Kim, G.; Hong, S.J.;
et al. Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density. Micromachines 2024, 15, 300.
https://doi.org/10.3390/mi15030300
AMA Style
Park M, Yoo B, Hong M, Cho D, Jeong Y, Park C, Kim J, Ha T-M, Kim G, Hong SJ,
et al. Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density. Micromachines. 2024; 15(3):300.
https://doi.org/10.3390/mi15030300
Chicago/Turabian Style
Park, Myeongho, Bin Yoo, Myeonghwan Hong, Daeun Cho, Yunjin Jeong, Cheolheon Park, Jaemin Kim, Tae-Min Ha, Garam Kim, Sang Jeen Hong,
and et al. 2024. "Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density" Micromachines 15, no. 3: 300.
https://doi.org/10.3390/mi15030300
APA Style
Park, M., Yoo, B., Hong, M., Cho, D., Jeong, Y., Park, C., Kim, J., Ha, T.-M., Kim, G., Hong, S. J., & Lee, D.
(2024). Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density. Micromachines, 15(3), 300.
https://doi.org/10.3390/mi15030300
