Sun, Y.; Ma, K.; Song, Y.; Zi, T.; Liu, X.; Feng, Z.; Zhou, Y.; Liu, S.
Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods. Micromachines 2023, 14, 1695.
https://doi.org/10.3390/mi14091695
AMA Style
Sun Y, Ma K, Song Y, Zi T, Liu X, Feng Z, Zhou Y, Liu S.
Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods. Micromachines. 2023; 14(9):1695.
https://doi.org/10.3390/mi14091695
Chicago/Turabian Style
Sun, Yameng, Kun Ma, Yifan Song, Tongtong Zi, Xun Liu, Zheng Feng, Yang Zhou, and Sheng Liu.
2023. "Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods" Micromachines 14, no. 9: 1695.
https://doi.org/10.3390/mi14091695
APA Style
Sun, Y., Ma, K., Song, Y., Zi, T., Liu, X., Feng, Z., Zhou, Y., & Liu, S.
(2023). Failure Analysis for Gold Wire Bonding of Sensor Packaging Based on Experimental and Numerical Methods. Micromachines, 14(9), 1695.
https://doi.org/10.3390/mi14091695
