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Journal: Micromachines, 2023
Volume: 14
Number: 838
838
Article: Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging
Authors: by Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Guannan Yang and Chengqiang Cui
Link: https://www.mdpi.com/2072-666X/14/4/838

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