Article Versions Notes

Cao J, Zhang J, Wu B, Tang H, Ding Y, Song K, Yang G, Cui C. Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging. Micromachines. 2023; 14(4):838. https://doi.org/10.3390/mi14040838

Cao, Jun, Junchao Zhang, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Guannan Yang, and Chengqiang Cui. 2023. "Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging" Micromachines 14, no. 4: 838. https://doi.org/10.3390/mi14040838

Cao, J., Zhang, J., Wu, B., Tang, H., Ding, Y., Song, K., Yang, G., & Cui, C. (2023). Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging. Micromachines, 14(4), 838. https://doi.org/10.3390/mi14040838