Zhao, K.; Zhao, J.; Wei, X.; Guan, X.; Deng, C.; Dai, B.; Zhu, J.
Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management. Micromachines 2023, 14, 290.
https://doi.org/10.3390/mi14020290
AMA Style
Zhao K, Zhao J, Wei X, Guan X, Deng C, Dai B, Zhu J.
Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management. Micromachines. 2023; 14(2):290.
https://doi.org/10.3390/mi14020290
Chicago/Turabian Style
Zhao, Kechen, Jiwen Zhao, Xiaoyun Wei, Xiaoyu Guan, Chaojun Deng, Bing Dai, and Jiaqi Zhu.
2023. "Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management" Micromachines 14, no. 2: 290.
https://doi.org/10.3390/mi14020290
APA Style
Zhao, K., Zhao, J., Wei, X., Guan, X., Deng, C., Dai, B., & Zhu, J.
(2023). Bottom-Up Cu Filling of High-Aspect-Ratio through-Diamond vias for 3D Integration in Thermal Management. Micromachines, 14(2), 290.
https://doi.org/10.3390/mi14020290