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Journal: Micromachines, 2022
Volume: 13
Number: 1305

Article: RLC Circuit Forecast in Analog IC Packaging and Testing by Machine Learning Techniques
Authors: by Jung-Pin Lai, Ying-Lei Lin, Ho-Chuan Lin, Chih-Yuan Shih, Yu-Po Wang and Ping-Feng Pai
Link: https://www.mdpi.com/2072-666X/13/8/1305

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