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Journal: Micromachines, 2022
Volume: 13
Number: 1147
1147
Article: Fabrication and Electrical Characterization of High Aspect Ratio Through-Silicon Vias with Polyimide Liner for 3D Integration
Authors: by Xuyan Chen, Zhiming Chen, Lei Xiao, Yigang Hao, Han Wang, Yingtao Ding and Ziyue Zhang
Link: https://www.mdpi.com/2072-666X/13/7/1147

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