Chen, Z.; Gengenbach, U.; Liu, X.; Scholz, A.; Zimmermann, L.; Aghassi-Hagmann, J.; Koker, L.
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics. Micromachines 2022, 13, 583.
https://doi.org/10.3390/mi13040583
AMA Style
Chen Z, Gengenbach U, Liu X, Scholz A, Zimmermann L, Aghassi-Hagmann J, Koker L.
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics. Micromachines. 2022; 13(4):583.
https://doi.org/10.3390/mi13040583
Chicago/Turabian Style
Chen, Zehua, Ulrich Gengenbach, Xinnan Liu, Alexander Scholz, Lukas Zimmermann, Jasmin Aghassi-Hagmann, and Liane Koker.
2022. "An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics" Micromachines 13, no. 4: 583.
https://doi.org/10.3390/mi13040583
APA Style
Chen, Z., Gengenbach, U., Liu, X., Scholz, A., Zimmermann, L., Aghassi-Hagmann, J., & Koker, L.
(2022). An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics. Micromachines, 13(4), 583.
https://doi.org/10.3390/mi13040583