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Journal: Micromachines, 2022
Volume: 13
Number: 391

Article: A Novel Feature Extraction Algorithm and System for Flexible Integrated Circuit Packaging Substrate
Authors: by Dan Huang, Juan Wang, Yong Zeng, Yongxing Yu and Yueming Hu
Link: https://www.mdpi.com/2072-666X/13/3/391

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