Wu, Y.; Hu, B.; Ma, X.; Wang, Y.; Li, W.; Wang, S.
Enhancement of Binding Kinetics on Affinity Substrates Using Asymmetric Electroosmotic Flow on a Sinusoidal Bipolar Electrode. Micromachines 2022, 13, 207.
https://doi.org/10.3390/mi13020207
AMA Style
Wu Y, Hu B, Ma X, Wang Y, Li W, Wang S.
Enhancement of Binding Kinetics on Affinity Substrates Using Asymmetric Electroosmotic Flow on a Sinusoidal Bipolar Electrode. Micromachines. 2022; 13(2):207.
https://doi.org/10.3390/mi13020207
Chicago/Turabian Style
Wu, Yupan, Bowen Hu, Xun Ma, Yucheng Wang, Wei Li, and Shaoxi Wang.
2022. "Enhancement of Binding Kinetics on Affinity Substrates Using Asymmetric Electroosmotic Flow on a Sinusoidal Bipolar Electrode" Micromachines 13, no. 2: 207.
https://doi.org/10.3390/mi13020207
APA Style
Wu, Y., Hu, B., Ma, X., Wang, Y., Li, W., & Wang, S.
(2022). Enhancement of Binding Kinetics on Affinity Substrates Using Asymmetric Electroosmotic Flow on a Sinusoidal Bipolar Electrode. Micromachines, 13(2), 207.
https://doi.org/10.3390/mi13020207