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Journal: Micromachines, 2021
Volume: 12
Number: 856
Article:
Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist
Authors:
by
Florian Janek, Nadine Eichhorn, Sascha Weser, Kerstin Gläser, Wolfgang Eberhardt and André Zimmermann
Link:
https://www.mdpi.com/2072-666X/12/8/856
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