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Journal: Micromachines, 2021
Volume: 12
Number: 480
Article:
Bottom-Up (Cu, Ag, Au)/Al2O3/Bi2Te3 Assembled Thermoelectric Heterostructures
Authors:
by
Zhenhua Wu, Shuai Zhang, Zekun Liu, Cheng Lu and Zhiyu Hu
Link:
https://www.mdpi.com/2072-666X/12/5/480
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