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Micromachines
Volume 12
Issue 2
10.3390/mi12020102
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Article

A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers

by
Yurong He
1,2,
Chaowei Si
1,*,
Guowei Han
1,2,*,
Yongmei Zhao
1,2,
Jin Ning
1,2,3,4,5,* and
Fuhua Yang
1,2
1
Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100049, China
2
Center of Materials Science and Optoelectronics Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
3
Engineering Research Center for Semiconductor Integrated Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
4
School of Electronic, Electrical and Communication Engineering, University of Chinese Academy of Sciences, Beijing 100049, China
5
State Key Laboratory of Transducer Technology, Chinese Academy of Sciences, Beijing 100083, China
*
Authors to whom correspondence should be addressed.
Micromachines 2021, 12(2), 102; https://doi.org/10.3390/mi12020102
Submission received: 3 December 2020 / Revised: 20 January 2021 / Accepted: 20 January 2021 / Published: 21 January 2021
(This article belongs to the Section E: Engineering and Technology)
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Abstract

In this paper, we report a novel teeter-totter type accelerometer based on glass-silicon composite wafers. Unlike the ordinary micro-electro-mechanical systems (MEMS) accelerometers, the entire structure of the accelerometer, includes the mass, the springs, and the composite wafer. The composite wafer is expected to serve as the electrical feedthrough and the fixed capacitance plate at the same time, to simplify the fabrication process, and to save on chip area. It is manufactured by filling melted borosilicate glass into an etched silicon wafer and polishing the wafer flat. A sensitivity of 51.622 mV/g in the range of ±5 g (g = 9.8 m/s2), a zero-bias stability under 0.2 mg, and the noise floor with 11.28 µg/√Hz were obtained, which meet the needs of most acceleration detecting applications. The micromachining solution is beneficial for vertical interconnection and miniaturization of MEMS devices.
Keywords: MEMS; accelerometer; glass–silicon composite wafer; vertical signal extraction; miniaturization MEMS; accelerometer; glass–silicon composite wafer; vertical signal extraction; miniaturization

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MDPI and ACS Style

He, Y.; Si, C.; Han, G.; Zhao, Y.; Ning, J.; Yang, F. A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers. Micromachines 2021, 12, 102. https://doi.org/10.3390/mi12020102

AMA Style

He Y, Si C, Han G, Zhao Y, Ning J, Yang F. A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers. Micromachines. 2021; 12(2):102. https://doi.org/10.3390/mi12020102

Chicago/Turabian Style

He, Yurong, Chaowei Si, Guowei Han, Yongmei Zhao, Jin Ning, and Fuhua Yang. 2021. "A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers" Micromachines 12, no. 2: 102. https://doi.org/10.3390/mi12020102

APA Style

He, Y., Si, C., Han, G., Zhao, Y., Ning, J., & Yang, F. (2021). A Novel Fabrication Method for a Capacitive MEMS Accelerometer Based on Glass–Silicon Composite Wafers. Micromachines, 12(2), 102. https://doi.org/10.3390/mi12020102

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