Kim, T.K.; Bae, J.-H.; Kim, J.; Cho, M.K.; Kim, Y.-C.; Jin, S.; Chun, D.
Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching. Micromachines 2020, 11, 744.
https://doi.org/10.3390/mi11080744
AMA Style
Kim TK, Bae J-H, Kim J, Cho MK, Kim Y-C, Jin S, Chun D.
Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching. Micromachines. 2020; 11(8):744.
https://doi.org/10.3390/mi11080744
Chicago/Turabian Style
Kim, Tae Kyoung, Jee-Hwan Bae, Juyoung Kim, Min Kyung Cho, Yu-Chan Kim, Sungho Jin, and Dongwon Chun.
2020. "Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching" Micromachines 11, no. 8: 744.
https://doi.org/10.3390/mi11080744
APA Style
Kim, T. K., Bae, J.-H., Kim, J., Cho, M. K., Kim, Y.-C., Jin, S., & Chun, D.
(2020). Curved Structure of Si by Improving Etching Direction Controllability in Magnetically Guided Metal-Assisted Chemical Etching. Micromachines, 11(8), 744.
https://doi.org/10.3390/mi11080744