Order Article Reprints
Journal: MicromachinesVolume: 10Number: 351
Article: A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging
- Authors:
- Min Meng1,2,
- Lijuan Cheng1,2 and
- Kai Yang1,2
- et al.
MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.