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Journal: Materials, 2025
Volume: 18
Number: 886
886
Article: Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders
Authors: by Xiaochen Xie, Pengrong Lin, Binhao Lian, Shimeng Xu, Yong Wang, Shuyuan Shi, Leqi Fu and Xiuchen Zhao
Link: https://www.mdpi.com/1996-1944/18/4/886

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