Article Versions Notes

Xie X, Lin P, Lian B, Xu S, Wang Y, Shi S, Fu L, Zhao X. Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders. Materials. 2025; 18(4):886. https://doi.org/10.3390/ma18040886

Xie, Xiaochen, Pengrong Lin, Binhao Lian, Shimeng Xu, Yong Wang, Shuyuan Shi, Leqi Fu, and Xiuchen Zhao. 2025. "Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders" Materials 18, no. 4: 886. https://doi.org/10.3390/ma18040886

Xie, X., Lin, P., Lian, B., Xu, S., Wang, Y., Shi, S., Fu, L., & Zhao, X. (2025). Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders. Materials, 18(4), 886. https://doi.org/10.3390/ma18040886