Liang, C.; Tian, C.; Zhang, Y.; He, X.; Bian, Y.; Dong, B.; Yu, G.; Li, S.
Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits. Materials 2025, 18, 5154.
https://doi.org/10.3390/ma18225154
AMA Style
Liang C, Tian C, Zhang Y, He X, Bian Y, Dong B, Yu G, Li S.
Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits. Materials. 2025; 18(22):5154.
https://doi.org/10.3390/ma18225154
Chicago/Turabian Style
Liang, Chaofan, Chongxin Tian, Yanmei Zhang, Xiuli He, Yanhua Bian, Binxin Dong, Gang Yu, and Shaoxia Li.
2025. "Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits" Materials 18, no. 22: 5154.
https://doi.org/10.3390/ma18225154
APA Style
Liang, C., Tian, C., Zhang, Y., He, X., Bian, Y., Dong, B., Yu, G., & Li, S.
(2025). Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits. Materials, 18(22), 5154.
https://doi.org/10.3390/ma18225154