Article Versions Notes

Park H-S, Na C-Y, Kim J-W, Jung W-S, Park J-H, Lim J-W, Yang Y-G. Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps. Materials. 2025; 18(19):4602. https://doi.org/10.3390/ma18194602

Park, Hwa-Sun, Chang-Yun Na, Jong-Wook Kim, Woon-Seok Jung, Jae-Hyuk Park, Jong-Woo Lim, and Youn-Goo Yang. 2025. "Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps" Materials 18, no. 19: 4602. https://doi.org/10.3390/ma18194602

Park, H.-S., Na, C.-Y., Kim, J.-W., Jung, W.-S., Park, J.-H., Lim, J.-W., & Yang, Y.-G. (2025). Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps. Materials, 18(19), 4602. https://doi.org/10.3390/ma18194602