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Journal: Materials, 2025
Volume: 18
Number: 3678

Article: Research on the Influence Mechanism of Thermal Load on the Au-Sn Sealing Weld State on Three-Dimensional DPC Substrates
Authors: by Heran Zhao, Lihua Cao, ShiZhao Wang, He Zhang and Mingxiang Chen
Link: https://www.mdpi.com/1996-1944/18/15/3678

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