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Journal: Materials, 2025
Volume: 18
Number: 3348
Article:
Multi-Scale Transient Thermo-Mechanical Coupling Analysis Method for the SiCf/SiC Composite Guide Vane
Authors:
by
Min Li, Xue Chen, Yu Deng, Wenjun Wang, Jian Li, Evance Obara, Zhilin Han and Chuyang Luo
Link:
https://www.mdpi.com/1996-1944/18/14/3348
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