Order Article Reprints

Huang J-H, Shih P-S, Renganathan V, Gräfner SJ, Lin Y-C, Kao C-L, Lin Y-S, Hung Y-C, Kao CR. A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. Materials. 2024; 17(7):1638. https://doi.org/10.3390/ma17071638

Huang, Jeng-Hau, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, and Chengheng Robert Kao. 2024. "A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications" Materials 17, no. 7: 1638. https://doi.org/10.3390/ma17071638

Huang, J.-H., Shih, P.-S., Renganathan, V., Gräfner, S. J., Lin, Y.-C., Kao, C.-L., Lin, Y.-S., Hung, Y.-C., & Kao, C. R. (2024). A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. Materials, 17(7), 1638. https://doi.org/10.3390/ma17071638