Verhelst, J.; Vandersanden, S.; Nouwen, O.; Rineau, F.
Fungal Strain Influences Thermal Conductivity, Hydrophobicity, Color Homogeneity, and Mold Contamination of Mycelial Composites. Materials 2024, 17, 6050.
https://doi.org/10.3390/ma17246050
AMA Style
Verhelst J, Vandersanden S, Nouwen O, Rineau F.
Fungal Strain Influences Thermal Conductivity, Hydrophobicity, Color Homogeneity, and Mold Contamination of Mycelial Composites. Materials. 2024; 17(24):6050.
https://doi.org/10.3390/ma17246050
Chicago/Turabian Style
Verhelst, Joris, Simon Vandersanden, Olivier Nouwen, and François Rineau.
2024. "Fungal Strain Influences Thermal Conductivity, Hydrophobicity, Color Homogeneity, and Mold Contamination of Mycelial Composites" Materials 17, no. 24: 6050.
https://doi.org/10.3390/ma17246050
APA Style
Verhelst, J., Vandersanden, S., Nouwen, O., & Rineau, F.
(2024). Fungal Strain Influences Thermal Conductivity, Hydrophobicity, Color Homogeneity, and Mold Contamination of Mycelial Composites. Materials, 17(24), 6050.
https://doi.org/10.3390/ma17246050