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Journal: Materials, 2024
Volume: 17
Number: 6039
6039
Article: Corrosion Behavior of Copper Foil on PCB Substrates Under Atmospheric Environment in Sichuan-Tibet Region of China
Authors: by Xueqing Yang, Haifeng Jin, Dongfang Jia, Jinke Wang, Zhibin Chen, Rui Tian, Shiyao Du and Lingwei Ma
Link: https://www.mdpi.com/1996-1944/17/24/6039

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