Gu, M.; Nam, H.; Park, S.; Shin, M.; Choa, S.-H.
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications. Materials 2024, 17, 5142.
https://doi.org/10.3390/ma17215142
AMA Style
Gu M, Nam H, Park S, Shin M, Choa S-H.
Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications. Materials. 2024; 17(21):5142.
https://doi.org/10.3390/ma17215142
Chicago/Turabian Style
Gu, Moses, Hyunjin Nam, Sehoon Park, Minkyung Shin, and Sung-Hoon Choa.
2024. "Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications" Materials 17, no. 21: 5142.
https://doi.org/10.3390/ma17215142
APA Style
Gu, M., Nam, H., Park, S., Shin, M., & Choa, S.-H.
(2024). Highly Robust, Pressureless Silver Sinter-Bonding Technology Using PMMA Combustion for Power Semiconductor Applications. Materials, 17(21), 5142.
https://doi.org/10.3390/ma17215142