Characterization and Growth Kinetics of Borides Layers on Near-Alpha Titanium Alloys

Pack boriding with CeO₂ was performed on the powder metallurgical (PM) near-α type titanium alloy at a temperature of 1273–1373 K for 5–15 h followed by air cooling. The microstructure analysis showed that the boride layer on the surface of the alloy was mainly composed of a monolithic TiB₂ outer layer, inner whisker TiB and sub-micron sized flake-like TiB layer. The growth kinetics of the TiB₂ and TiB layers obeyed the parabolic diffusion model. The diffusion coefficient of boron in the boride layers obtained in the present study was well within the ranges reported in the literature. The activation energies of boron in the TiB₂ and TiB layers during the pack boriding were estimated to be 166.4 kJ/mol and 122.8 kJ/mol, respectively. Friction tests showed that alloys borided at moderate temperatures and times had lower friction coefficients, which may have been due to the fine grain strengthening effect of TiB whiskers. The alloy borided at 1273 K for 10 h had a minimum friction coefficient of 0.73.