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Journal: Materials, 2023
Volume: 16
Number: 2937
Article:
Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates
Authors:
by
Ling-Feng Wang, Zhe Li, Bo-An Zhou, Yu-Sen Duan, Ning Liu and Jing-Xian Zhang
Link:
https://www.mdpi.com/1996-1944/16/7/2937
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