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Journal: Materials, 2023
Volume: 16
Number: 2937

Article: Study on Tungsten Metallization and Interfacial Bonding of Silicon Nitride High-Temperature Co-Fired Ceramic Substrates
Authors: by Ling-Feng Wang, Zhe Li, Bo-An Zhou, Yu-Sen Duan, Ning Liu and Jing-Xian Zhang
Link: https://www.mdpi.com/1996-1944/16/7/2937

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