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Journal: Materials, 2023
Volume: 16
Number: 1790

Article: Silica-Fiber-Reinforced Composites for Microelectronic Applications: Effects of Curing Routes
Authors: by Imran Haider, Iftikhar Hussain Gul, Malik Adeel Umer and Mutawara Mahmood Baig
Link: https://www.mdpi.com/1996-1944/16/5/1790

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