Article Versions Notes

Luo X, Liang X, Wei Y, Hou L, Li R, Liu D, Li M, Zhou S. High Ampacity On-Chip Wires Implemented by Aligned Carbon Nanotube-Cu Composite. Materials. 2023; 16(3):1131. https://doi.org/10.3390/ma16031131

Luo, Xiaojia, Xiao Liang, Yang Wei, Ligan Hou, Ru Li, Dandan Liu, Mo Li, and Shuyu Zhou. 2023. "High Ampacity On-Chip Wires Implemented by Aligned Carbon Nanotube-Cu Composite" Materials 16, no. 3: 1131. https://doi.org/10.3390/ma16031131

Luo, X., Liang, X., Wei, Y., Hou, L., Li, R., Liu, D., Li, M., & Zhou, S. (2023). High Ampacity On-Chip Wires Implemented by Aligned Carbon Nanotube-Cu Composite. Materials, 16(3), 1131. https://doi.org/10.3390/ma16031131