Thien, J.; Rodewald, J.; Pohlmann, T.; Ruwisch, K.; Bertram, F.; Küpper, K.; Wollschläger, J.
Real-Time Monitoring of Strain Accumulation and Relief during Epitaxy of Ultrathin Co Ferrite Films with Varied Co Content. Materials 2023, 16, 7287.
https://doi.org/10.3390/ma16237287
AMA Style
Thien J, Rodewald J, Pohlmann T, Ruwisch K, Bertram F, Küpper K, Wollschläger J.
Real-Time Monitoring of Strain Accumulation and Relief during Epitaxy of Ultrathin Co Ferrite Films with Varied Co Content. Materials. 2023; 16(23):7287.
https://doi.org/10.3390/ma16237287
Chicago/Turabian Style
Thien, Jannis, Jari Rodewald, Tobias Pohlmann, Kevin Ruwisch, Florian Bertram, Karsten Küpper, and Joachim Wollschläger.
2023. "Real-Time Monitoring of Strain Accumulation and Relief during Epitaxy of Ultrathin Co Ferrite Films with Varied Co Content" Materials 16, no. 23: 7287.
https://doi.org/10.3390/ma16237287
APA Style
Thien, J., Rodewald, J., Pohlmann, T., Ruwisch, K., Bertram, F., Küpper, K., & Wollschläger, J.
(2023). Real-Time Monitoring of Strain Accumulation and Relief during Epitaxy of Ultrathin Co Ferrite Films with Varied Co Content. Materials, 16(23), 7287.
https://doi.org/10.3390/ma16237287
