Kim, S.-W.; Lee, H.-S.; Jun, D.-S.; Lee, S.-E.; Lee, J.-H.; Lee, H.-C.
Enhancing the Plasma-Resistance Properties of Li2O–Al2O3–SiO2 Glasses for the Semiconductor Etch Process via Alkaline Earth Oxide Incorporation. Materials 2023, 16, 5112.
https://doi.org/10.3390/ma16145112
AMA Style
Kim S-W, Lee H-S, Jun D-S, Lee S-E, Lee J-H, Lee H-C.
Enhancing the Plasma-Resistance Properties of Li2O–Al2O3–SiO2 Glasses for the Semiconductor Etch Process via Alkaline Earth Oxide Incorporation. Materials. 2023; 16(14):5112.
https://doi.org/10.3390/ma16145112
Chicago/Turabian Style
Kim, So-Won, Hwan-Seok Lee, Deok-Sung Jun, Seong-Eui Lee, Joung-Ho Lee, and Hee-Chul Lee.
2023. "Enhancing the Plasma-Resistance Properties of Li2O–Al2O3–SiO2 Glasses for the Semiconductor Etch Process via Alkaline Earth Oxide Incorporation" Materials 16, no. 14: 5112.
https://doi.org/10.3390/ma16145112
APA Style
Kim, S.-W., Lee, H.-S., Jun, D.-S., Lee, S.-E., Lee, J.-H., & Lee, H.-C.
(2023). Enhancing the Plasma-Resistance Properties of Li2O–Al2O3–SiO2 Glasses for the Semiconductor Etch Process via Alkaline Earth Oxide Incorporation. Materials, 16(14), 5112.
https://doi.org/10.3390/ma16145112
