Qi, H.; Wang, Y.; Qi, Z.; Shi, L.; Fang, Z.; Zhang, L.; Riemer, O.; Karpuschewski, B.
A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics. Materials 2022, 15, 8486.
https://doi.org/10.3390/ma15238486
AMA Style
Qi H, Wang Y, Qi Z, Shi L, Fang Z, Zhang L, Riemer O, Karpuschewski B.
A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics. Materials. 2022; 15(23):8486.
https://doi.org/10.3390/ma15238486
Chicago/Turabian Style
Qi, Huan, Yuelei Wang, Zijian Qi, Liwu Shi, Zhufang Fang, Li Zhang, Oltmann Riemer, and Bernhard Karpuschewski.
2022. "A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics" Materials 15, no. 23: 8486.
https://doi.org/10.3390/ma15238486
APA Style
Qi, H., Wang, Y., Qi, Z., Shi, L., Fang, Z., Zhang, L., Riemer, O., & Karpuschewski, B.
(2022). A Novel Grain-Based DEM Model for Evaluating Surface Integrity in Scratching of RB-SiC Ceramics. Materials, 15(23), 8486.
https://doi.org/10.3390/ma15238486