Article Versions Notes

Li N, Hao J, Zhang Y, Wang W, Zhao J, Wu H, Wang X, Zhang H. Thermal Conductivity Stability of Interfacial in Situ Al₄C₃ Engineered Diamond/Al Composites Subjected to Thermal Cycling. Materials. 2022; 15(19):6640. https://doi.org/10.3390/ma15196640

Li, Ning, Jinpeng Hao, Yongjian Zhang, Wei Wang, Jie Zhao, Haijun Wu, Xitao Wang, and Hailong Zhang. 2022. "Thermal Conductivity Stability of Interfacial in Situ Al₄C₃ Engineered Diamond/Al Composites Subjected to Thermal Cycling" Materials 15, no. 19: 6640. https://doi.org/10.3390/ma15196640

Li, N., Hao, J., Zhang, Y., Wang, W., Zhao, J., Wu, H., Wang, X., & Zhang, H. (2022). Thermal Conductivity Stability of Interfacial in Situ Al₄C₃ Engineered Diamond/Al Composites Subjected to Thermal Cycling. Materials, 15(19), 6640. https://doi.org/10.3390/ma15196640