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Journal: Materials, 2022
Volume: 15
Number: 5524

Article: Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire
Authors: by Osamu Kamiya, Mamoru Takahashi, Yasuyuki Miyano, Shinichi Ito, Masanobu Nakatsu, Hiroyuki Mizuma, Yuichi Iwama, Kenji Murata, Junpei Nanao, Makoto Kawano, Arata Maisawa and Takashi Kazumi
Link: https://www.mdpi.com/1996-1944/15/16/5524

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