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Journal: Materials, 2022
Volume: 15
Number: 5524
Article:
Cutting of Diamond Substrate Using Fixed Diamond Grain Saw Wire
Authors:
by
Osamu Kamiya, Mamoru Takahashi, Yasuyuki Miyano, Shinichi Ito, Masanobu Nakatsu, Hiroyuki Mizuma, Yuichi Iwama, Kenji Murata, Junpei Nanao, Makoto Kawano, Arata Maisawa and Takashi Kazumi
Link:
https://www.mdpi.com/1996-1944/15/16/5524
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