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Journal: Materials, 2021
Volume: 14
Number: 2335

Article: Effect of Cu Content on Performance of Sn-Zn-Cu Lead-Free Solder Alloys Designed by Cluster-Plus-Glue-Atom Model
Authors: by Jialong Qiu, Yanzhi Peng, Peng Gao and Caiju Li
Link: https://www.mdpi.com/1996-1944/14/9/2335

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