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Journal: Materials, 2021
Volume: 14
Number: 3723

Article: Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
Authors: by Ming-Yi Tsai, Yu-Wen Wang and Chia-Ming Liu
Link: https://www.mdpi.com/1996-1944/14/13/3723

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