Awrejcewicz, J.; Pavlov, S.P.; Krysko, A.V.; Zhigalov, M.V.; Bodyagina, K.S.; Krysko, V.A.
Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization. Materials 2020, 13, 1862.
https://doi.org/10.3390/ma13081862
AMA Style
Awrejcewicz J, Pavlov SP, Krysko AV, Zhigalov MV, Bodyagina KS, Krysko VA.
Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization. Materials. 2020; 13(8):1862.
https://doi.org/10.3390/ma13081862
Chicago/Turabian Style
Awrejcewicz, Jan, Sergey P. Pavlov, Anton V. Krysko, Maxim V. Zhigalov, Kseniya S. Bodyagina, and Vadim A. Krysko.
2020. "Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization" Materials 13, no. 8: 1862.
https://doi.org/10.3390/ma13081862
APA Style
Awrejcewicz, J., Pavlov, S. P., Krysko, A. V., Zhigalov, M. V., Bodyagina, K. S., & Krysko, V. A.
(2020). Decreasing Shear Stresses of the Solder Joints for Mechanical and Thermal Loads by Topological Optimization. Materials, 13(8), 1862.
https://doi.org/10.3390/ma13081862