Fang, X.; Kang, Q.; Ding, J.; Sun, L.; Maeda, R.; Jiang, Z.
Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path. Materials 2020, 13, 1710.
https://doi.org/10.3390/ma13071710
AMA Style
Fang X, Kang Q, Ding J, Sun L, Maeda R, Jiang Z.
Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path. Materials. 2020; 13(7):1710.
https://doi.org/10.3390/ma13071710
Chicago/Turabian Style
Fang, Xudong, Qiang Kang, Jianjun Ding, Lin Sun, Ryutaro Maeda, and Zhuangde Jiang.
2020. "Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path" Materials 13, no. 7: 1710.
https://doi.org/10.3390/ma13071710
APA Style
Fang, X., Kang, Q., Ding, J., Sun, L., Maeda, R., & Jiang, Z.
(2020). Stress Distribution in Silicon Subjected to Atomic Scale Grinding with a Curved Tool Path. Materials, 13(7), 1710.
https://doi.org/10.3390/ma13071710