Schiavone, G.; Murray, J.; Perry, R.; Mount, A.R.; Desmulliez, M.P.Y.; Walton, A.J.
Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes. Materials 2017, 10, 323.
https://doi.org/10.3390/ma10030323
AMA Style
Schiavone G, Murray J, Perry R, Mount AR, Desmulliez MPY, Walton AJ.
Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes. Materials. 2017; 10(3):323.
https://doi.org/10.3390/ma10030323
Chicago/Turabian Style
Schiavone, Giuseppe, Jeremy Murray, Richard Perry, Andrew R. Mount, Marc P. Y. Desmulliez, and Anthony J. Walton.
2017. "Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes" Materials 10, no. 3: 323.
https://doi.org/10.3390/ma10030323
APA Style
Schiavone, G., Murray, J., Perry, R., Mount, A. R., Desmulliez, M. P. Y., & Walton, A. J.
(2017). Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes. Materials, 10(3), 323.
https://doi.org/10.3390/ma10030323