Ogi, J.; Sano, F.; Nakata, T.; Kubo, Y.; Onishi, W.; Koswaththage, C.; Mochizuki, T.; Tashiro, Y.; Hizu, K.; Takatsuka, T.;
et al. A 3.06 μm Single-Photon Avalanche Diode Pixel with Embedded Metal Contact and Power Grid on Deep Trench Pixel Isolation for High-Resolution Photon Counting. Sensors 2023, 23, 8906.
https://doi.org/10.3390/s23218906
AMA Style
Ogi J, Sano F, Nakata T, Kubo Y, Onishi W, Koswaththage C, Mochizuki T, Tashiro Y, Hizu K, Takatsuka T,
et al. A 3.06 μm Single-Photon Avalanche Diode Pixel with Embedded Metal Contact and Power Grid on Deep Trench Pixel Isolation for High-Resolution Photon Counting. Sensors. 2023; 23(21):8906.
https://doi.org/10.3390/s23218906
Chicago/Turabian Style
Ogi, Jun, Fumiaki Sano, Tatsuya Nakata, Yoshiki Kubo, Wataru Onishi, Charith Koswaththage, Takeya Mochizuki, Yoshiaki Tashiro, Kazuki Hizu, Takafumi Takatsuka,
and et al. 2023. "A 3.06 μm Single-Photon Avalanche Diode Pixel with Embedded Metal Contact and Power Grid on Deep Trench Pixel Isolation for High-Resolution Photon Counting" Sensors 23, no. 21: 8906.
https://doi.org/10.3390/s23218906
APA Style
Ogi, J., Sano, F., Nakata, T., Kubo, Y., Onishi, W., Koswaththage, C., Mochizuki, T., Tashiro, Y., Hizu, K., Takatsuka, T., Watanabe, I., Koga, F., Hirano, T., & Oike, Y.
(2023). A 3.06 μm Single-Photon Avalanche Diode Pixel with Embedded Metal Contact and Power Grid on Deep Trench Pixel Isolation for High-Resolution Photon Counting. Sensors, 23(21), 8906.
https://doi.org/10.3390/s23218906
