Next Article in Journal
Patch Transporter: Incentivized, Decentralized Software Patch System for WSN and IoT Environments
Next Article in Special Issue
Tunable Nanosensor Based on Fano Resonances Created by Changing the Deviation Angle of the Metal Core in a Plasmonic Cavity
Previous Article in Journal
Robust Object Tracking Based on Motion Consistency
Article

Measurement of a 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation

1
School of Mechanical Engineering, Xi’an University of Science and Technology, Xi’an 710054, China
2
General Engineering Research Institute, Liverpool John Moores University, Liverpool L3 3AF, UK
3
School of Science, Xi’an University of Science and Technology, Xi’an 710054, China
*
Author to whom correspondence should be addressed.
Sensors 2018, 18(2), 573; https://doi.org/10.3390/s18020573
Received: 11 January 2018 / Revised: 8 February 2018 / Accepted: 8 February 2018 / Published: 13 February 2018
(This article belongs to the Special Issue Optical Waveguide Based Sensors)
In ultrasonic array imaging, 3D ultrasonic wavefields are normally recorded by an ultrasonic piezo array transducer. Its performance is limited by the configuration and size of the array transducer. In this paper, a method based on digital holographic interferometry is proposed to record the 3D ultrasonic wavefields instead of the array transducer, and the measurement system consisting of a pulsed laser, ultrasonic excitation, and synchronization and control circuit is designed. A consecutive sequence of holograms of ultrasonic wavefields are recorded by the system. The interferograms are calculated from the recorded holograms at different time sequence. The amplitudes and phases of the transient ultrasonic wavefields are recovered from the interferograms by phase unwrapping. The consecutive sequence of transient ultrasonic wavefields are stacked together to generate 3D ultrasonic wavefields. Simulation and experiments are carried out to verify the proposed technique, and preliminary results are presented. View Full-Text
Keywords: digital holographic microscopy; CCD sensor; array transducer; ultrasonic wavefield; ultrasonic imaging digital holographic microscopy; CCD sensor; array transducer; ultrasonic wavefield; ultrasonic imaging
Show Figures

Figure 1

MDPI and ACS Style

Wang, X.; Zhang, G.-M.; Ma, H.; Zhang, Y.; Wang, D. Measurement of a 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation. Sensors 2018, 18, 573. https://doi.org/10.3390/s18020573

AMA Style

Wang X, Zhang G-M, Ma H, Zhang Y, Wang D. Measurement of a 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation. Sensors. 2018; 18(2):573. https://doi.org/10.3390/s18020573

Chicago/Turabian Style

Wang, Xing, Guang-Ming Zhang, Hongwei Ma, Yishu Zhang, and Doudou Wang. 2018. "Measurement of a 3D Ultrasonic Wavefield Using Pulsed Laser Holographic Microscopy for Ultrasonic Nondestructive Evaluation" Sensors 18, no. 2: 573. https://doi.org/10.3390/s18020573

Find Other Styles
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Back to TopTop