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Sensors 2016, 16(5), 634;

Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer

College of Mechanical Engineering, Shanghai University of Engineering Science, Shanghai 201620, China
National Key Laboratory of Micro/Nano Fabrication Technology, School of Electronic Information and Electrical Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Author to whom correspondence should be addressed.
Academic Editor: Stefano Mariani
Received: 29 March 2016 / Revised: 27 April 2016 / Accepted: 27 April 2016 / Published: 5 May 2016
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
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This paper presents a bistable microswitch fully batch-fabricated on a single glass wafer, comprising of a microactuator, a signal transformer, a microspring and a permanent magnet. The bistable mechanism of the microswitch with large displacement of 160 μm depends on the balance of the magnetic force and elastic force. Both the magnetic force and elastic force were optimized by finite-element simulation to predict the reliable of the device. The prototype was fabricated and characterized. By utilizing thick laminated photoresist sacrificial layer, the large displacement was obtained to ensure the insulation of the microswitch. The testing results show that the microswitch realized the bistable mechanism at a 3–5 V input voltage and closed in 0.96 ms, which verified the simulation. View Full-Text
Keywords: MEMS; microswitch; magnetic; large displacement; microfabrication MEMS; microswitch; magnetic; large displacement; microfabrication

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Miao, X.; Dai, X.; Huang, Y.; Ding, G.; Zhao, X. Large Out-of-Plane Displacement Bistable Electromagnetic Microswitch on a Single Wafer. Sensors 2016, 16, 634.

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