Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering"

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A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 December 2008)

Special Issue Editor

Guest Editor
Dr. Stefano Mariani
Dipartimento di Ingegneria Civile e Ambientale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Website: http://www.dica.polimi.it/en/
E-Mail: stefano.mariani@polimi.it
Phone: +39 02 2399 4279
Fax: +39 02 2399 4300
Interests: MEMS; structural sensors; kalman filtering

Special Issue Information

Dear Colleagues,

Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.

MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.

As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.

The aim of this special issue is to collect high quality research results on all these aspects of MEMS engineering.

Dr. Stefano Mariani
Guest Editor

Keywords

  • micro-electro-mechanical-systems
  • multi-scale and multi-physics modelling
  • micro-fluidics
  • failure analysis
  • reliability analysis
  • package engineering

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Published Papers (35 papers)

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Displaying article 1-35
p. 20533-20542
by , , , ,  and
Sensors 2014, 14(11), 20533-20542; doi:10.3390/s141120533
Received: 28 August 2014; in revised form: 21 October 2014 / Accepted: 22 October 2014 / Published: 30 October 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 19507-19516
by , ,  and
Sensors 2014, 14(10), 19507-19516; doi:10.3390/s141019507
Received: 18 August 2014; in revised form: 25 September 2014 / Accepted: 14 October 2014 / Published: 17 October 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 18075-18095
by , ,  and
Sensors 2014, 14(10), 18075-18095; doi:10.3390/s141018075
Received: 14 August 2014; in revised form: 22 September 2014 / Accepted: 23 September 2014 / Published: 29 September 2014
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
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p. 1232-1250
by  and
Sensors 2010, 10(2), 1232-1250; doi:10.3390/s100201232
Received: 15 December 2009; in revised form: 31 December 2009 / Accepted: 23 January 2010 / Published: 2 February 2010
Show/Hide Abstract | Cited by 5 | PDF Full-text (524 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
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p. 9945-9964
by  and
Sensors 2009, 9(12), 9945-9964; doi:10.3390/s91209945
Received: 4 November 2009; in revised form: 27 November 2009 / Accepted: 27 November 2009 / Published: 8 December 2009
Show/Hide Abstract | Cited by 1 | PDF Full-text (650 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 7438-7452
by , ,  and
Sensors 2008, 8(11), 7438-7452; doi:10.3390/s8117438
Received: 11 October 2008; in revised form: 11 November 2008 / Accepted: 14 November 2008 / Published: 19 November 2008
Show/Hide Abstract | Cited by 1 | PDF Full-text (1192 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 7359-7368
by , ,  and
Sensors 2008, 8(11), 7359-7368; doi:10.3390/s8117359
Received: 9 October 2008; in revised form: 6 November 2008 / Accepted: 12 November 2008 / Published: 18 November 2008
Show/Hide Abstract | Cited by 9 | PDF Full-text (551 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 3706-3718
by , ,  and
Sensors 2008, 8(6), 3706-3718; doi:10.3390/s8063706
Received: 21 March 2008; in revised form: 24 May 2008 / Accepted: 2 June 2008 / Published: 3 June 2008
Show/Hide Abstract | Cited by 2 | PDF Full-text (574 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 2240-2261
by  and
Sensors 2008, 8(4), 2240-2261; doi:10.3390/s8042240
Received: 14 November 2007; Accepted: 26 March 2008 / Published: 29 March 2008
Show/Hide Abstract | Cited by 14 | PDF Full-text (303 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1475-1487
by ,  and
Sensors 2008, 8(3), 1475-1487; doi:10.3390/s8031475
Received: 30 January 2008; Accepted: 27 February 2008 / Published: 3 March 2008
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1308-1320
by ,  and
Sensors 2008, 8(2), 1308-1320; doi:10.3390/s8021308
Received: 15 February 2008; Accepted: 21 February 2008 / Published: 22 February 2008
Show/Hide Abstract | Cited by 6 | PDF Full-text (6644 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 994-1003
by ,  and
Sensors 2008, 8(2), 994-1003; doi:10.3390/s8020994
Received: 14 September 2007; Accepted: 8 February 2008 / Published: 19 February 2008
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1048-1069
by ,  and
Sensors 2008, 8(2), 1048-1069; doi:10.3390/s8021048
Received: 21 December 2007; Accepted: 14 February 2008 / Published: 15 February 2008
Show/Hide Abstract | Cited by 31 | PDF Full-text (1400 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 877-885
by ,  and
Sensors 2008, 8(2), 877-885; doi:10.3390/s8020877
Received: 10 January 2008; Accepted: 6 February 2008 / Published: 8 February 2008
Show/Hide Abstract | Cited by 4 | PDF Full-text (1527 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 700-710
by ,  and
Sensors 2008, 8(2), 700-710; doi:10.3390/s8020700
Received: 14 January 2008; Accepted: 29 January 2008 / Published: 6 February 2008
Show/Hide Abstract | Cited by 5 | PDF Full-text (4962 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 767-783
by ,  and
Sensors 2008, 8(2), 767-783; doi:10.3390/s8020767
Received: 19 November 2007; Accepted: 28 January 2008 / Published: 6 February 2008
Show/Hide Abstract | Cited by 4 | PDF Full-text (638 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 784-799
by , ,  and
Sensors 2008, 8(2), 784-799; doi:10.3390/s8020784
Received: 30 November 2007; Accepted: 31 January 2008 / Published: 6 February 2008
Show/Hide Abstract | Cited by 10 | PDF Full-text (599 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 222-235
by , ,  and
Sensors 2008, 8(1), 222-235; doi:10.3390/s8010222
Received: 30 November 2007; Accepted: 8 January 2008 / Published: 21 January 2008
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 211-221
by , ,  and
Sensors 2008, 8(1), 211-221; doi:10.3390/s8010211
Received: 4 December 2007; Accepted: 8 January 2008 / Published: 21 January 2008
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 3071-3083
by , ,  and
Sensors 2007, 7(12), 3071-3083; doi:10.3390/s7123071
Received: 25 October 2007; Accepted: 29 November 2007 / Published: 4 December 2007
Show/Hide Abstract | Cited by 1 | PDF Full-text (362 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 3012-3026
by  and
Sensors 2007, 7(12), 3012-3026; doi:10.3390/s7123012
Received: 5 November 2007; Accepted: 27 November 2007 / Published: 29 November 2007
Show/Hide Abstract | Cited by 11 | PDF Full-text (324 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 2997-3011
by , ,  and
Sensors 2007, 7(11), 2997-3011; doi:10.3390/s7112997
Received: 12 October 2007; Accepted: 14 November 2007 / Published: 26 November 2007
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(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 2846-2859
by , , , ,  and
Sensors 2007, 7(11), 2846-2859; doi:10.3390/s7112846
Received: 27 September 2007; Accepted: 14 November 2007 / Published: 20 November 2007
Show/Hide Abstract | Cited by 2 | PDF Full-text (602 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 3386-3398
by ,  and
Sensors 2007, 7(12), 3386-3398; doi:10.3390/s7123386
Received: 19 November 2007; Accepted: 18 December 2007 / Published: 19 November 2007
Show/Hide Abstract | Cited by 12 | PDF Full-text (2328 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 2660-2670
by  and
Sensors 2007, 7(11), 2660-2670; doi:10.3390/s7112670
Received: 18 October 2007; Accepted: 7 November 2007 / Published: 9 November 2007
Show/Hide Abstract | Cited by 17 | PDF Full-text (618 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 2174-2182
by ,  and
Sensors 2007, 7(10), 2174-2182; doi:10.3390/s7102174
Received: 18 July 2007; Accepted: 27 September 2007 / Published: 9 October 2007
Show/Hide Abstract | Cited by 5 | PDF Full-text (394 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1887-1900
by  and
Sensors 2007, 7(9), 1887-1900; doi:10.3390/s7091887
Received: 6 August 2007; Accepted: 10 September 2007 / Published: 11 September 2007
Show/Hide Abstract | Cited by 13 | PDF Full-text (365 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1817-1833
by , ,  and
Sensors 2007, 7(9), 1817-1833; doi:10.3390/s7081817
Received: 30 August 2007; Accepted: 6 September 2007 / Published: 7 September 2007
Show/Hide Abstract | Cited by 26 | PDF Full-text (1199 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1720-1730
by  and
Sensors 2007, 7(9), 1720-1730; doi:10.3390/s7091720
Received: 19 July 2007; Accepted: 31 August 2007 / Published: 3 September 2007
Show/Hide Abstract | Cited by 3 | PDF Full-text (758 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1643-1654
by , , , , ,  and
Sensors 2007, 7(8), 1643-1654; doi:10.3390/s7081643
Received: 11 June 2007; Accepted: 24 August 2007 / Published: 27 August 2007
Show/Hide Abstract | Cited by 9 | PDF Full-text (1374 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1399-1414
by ,  and
Sensors 2007, 7(8), 1399-1414; doi:10.3390/s7081399
Received: 27 June 2007; Accepted: 2 August 2007 / Published: 3 August 2007
Show/Hide Abstract | Cited by 4 | PDF Full-text (1542 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1387-1398
by , ,  and
Sensors 2007, 7(8), 1387-1398; doi:10.3390/s7081387
Received: 21 June 2007; Accepted: 30 July 2007 / Published: 31 July 2007
Show/Hide Abstract | Cited by 17 | PDF Full-text (7464 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 1069-1090
by  and
Sensors 2007, 7(7), 1069-1090; doi:10.3390/s7071069
Received: 18 May 2007; Accepted: 27 June 2007 / Published: 28 June 2007
Show/Hide Abstract | Cited by 13 | PDF Full-text (757 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 760-796
by ,  and
Sensors 2007, 7(5), 760-796; doi:10.3390/s7050760
Received: 13 April 2007; Accepted: 21 May 2007 / Published: 31 May 2007
Show/Hide Abstract | Cited by 24 | PDF Full-text (605 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
p. 697-707
by , ,  and
Sensors 2007, 7(5), 697-707; doi:10.3390/s7050697
Received: 2 May 2007; Accepted: 21 May 2007 / Published: 24 May 2007
Show/Hide Abstract | Cited by 3 | PDF Full-text (774 KB) | HTML Full-text | XML Full-text
(This article belongs to the Special Issue Modeling, Testing and Reliability Issues in MEMS Engineering)
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Last update: 4 March 2014

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