Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering"

Guest Editor
Dr. Stefano Mariani
Dipartimento di Ingegneria Strutturale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Website: http://www.stru.polimi.it
E-Mail:
Interests: MEMS; structural sensors; kalman filtering

Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.

MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.

As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.

The aim of this special issue is to collect high quality research results on all these aspects of MEMS engineering.

• micro-electro-mechanical-systems
• multi-scale and multi-physics modelling
• micro-fluidics
• failure analysis
• reliability analysis
• package engineering