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Modeling and Fabrication of Micro FET Pressure Sensor with Circuits
AbstractThis paper presents the simulation, fabrication and characterization of a microFET (field effect transistor) pressure sensor with readout circuits. The pressure sensorincludes 16 sensing cells in parallel. Each sensing cell that is circular shape is composed ofan MOS (metal oxide semiconductor) and a suspended membrane, which the suspendedmembrane is the movable gate of the MOS. The CoventorWare is used to simulate thebehaviors of the pressure sensor, and the HSPICE is employed to evaluate the characteristicsof the circuits. The pressure sensor integrated with circuits is manufactured using thecommercial 0.35 μm CMOS (complementary metal oxide semiconductor) process and apost-process. In order to obtain the suspended membranes, the pressure sensor requires apost-CMOS process. The post-process adopts etchants to etch the sacrificial layers in thepressure sensors to release the suspended membranes, and then the etch holes in the pressuresensor are sealed by LPCVD (low pressure chemical vapor deposition) parylene. Thepressure sensor produces a change in current when applying a pressure to the sensing cells.The circuits are utilized to convert the current variation of the pressure sensor into thevoltage output. Experimental results show that the pressure sensor has a sensitivity of 0.032mV/kPa in the pressure range of 0-500 kPa.
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Dai, C.-L.; Tai, Y.-W.; Kao, P.-H. Modeling and Fabrication of Micro FET Pressure Sensor with Circuits. Sensors 2007, 7, 3386-3398.View more citation formats
Dai C-L, Tai Y-W, Kao P-H. Modeling and Fabrication of Micro FET Pressure Sensor with Circuits. Sensors. 2007; 7(12):3386-3398.Chicago/Turabian Style
Dai, Ching-Liang; Tai, Yao-Wei; Kao, Pin-Hsu. 2007. "Modeling and Fabrication of Micro FET Pressure Sensor with Circuits." Sensors 7, no. 12: 3386-3398.
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