Special Issue "Modeling, Testing and Reliability Issues in MEMS Engineering - 2009"

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A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Physical Sensors".

Deadline for manuscript submissions: closed (31 December 2009)

Special Issue Editor

Guest Editor
Dr. Stefano Mariani
Dipartimento di Ingegneria Civile e Ambientale, Politecnico di Milano, Piazza L. da Vinci 32, 20133 Milano, Italy
Website: http://www.dica.polimi.it/en/
E-Mail: stefano.mariani@polimi.it
Phone: +39 02 2399 4279
Fax: +39 02 2399 4300
Interests: MEMS; structural sensors; kalman filtering

Special Issue Information

Dear Colleagues,

Micro-electro-mechanical-systems (MEMS) are devices on a millimeter scale, with micro-resolution. Each MEMS is given by the integration of mechanical elements, sensors, actuators and electronics on a common silicon substrate, obtained through micro-fabrication technology.
MEMS are often designed to work in mobile devices, and are therefore subject during their life to accidental mechanical loadings. Because of the MEMS size, multi-scale analyses are sometimes required in reliability analysis. Furthermore, also thermal, electrical, magnetic and environmental actions should be accounted for in a fully coupled multi-physics modelling of the devices.
As for packaging, some technical problems caused to the devices are not yet thoroughly understood and solved. Since standards do not necessarily apply to packaged MEMS, new knowledge-based testing methodologies need to be proposed.
The aim of this special issue is to collect high quality research results on all these aspects of MEMS engineering.

Dr. Stefano Mariani
Guest Editor

Keywords

  • micro-electro-mechanical-systems
  • multi-scale and multi-physics modelling
  • micro-fluidics
  • failure analysis
  • reliability analysis
  • package engineering

Published Papers (22 papers)

Sensors 2010, 10(6), 6149-6171; doi:10.3390/s100606149
Received: 9 March 2010; in revised form: 18 May 2010 / Accepted: 24 May 2010 / Published: 21 June 2010
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Sensors 2010, 10(5), 4950-4967; doi:10.3390/s100504950
Received: 31 December 2009; in revised form: 8 April 2010 / Accepted: 13 April 2010 / Published: 17 May 2010
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Sensors 2010, 10(4), 3989-4001; doi:10.3390/s100403989
Received: 5 January 2010; in revised form: 8 March 2010 / Accepted: 22 March 2010 / Published: 20 April 2010
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Sensors 2010, 10(4), 3835-3856; doi:10.3390/s100403835
Received: 22 February 2010; in revised form: 17 March 2010 / Accepted: 6 April 2010 / Published: 14 April 2010
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Sensors 2010, 10(3), 1652-1660; doi:10.3390/s100301652
Received: 31 December 2009; in revised form: 2 February 2010 / Accepted: 25 February 2010 / Published: 2 March 2010
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Sensors 2010, 10(3), 1535-1552; doi:10.3390/s100301535
Received: 31 December 2009; in revised form: 19 February 2010 / Accepted: 25 February 2010 / Published: 1 March 2010
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Sensors 2010, 10(2), 1338-1354; doi:10.3390/s100201338
Received: 29 December 2009; in revised form: 21 January 2010 / Accepted: 1 February 2010 / Published: 11 February 2010
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Sensors 2010, 10(2), 1315-1325; doi:10.3390/s100201315
Received: 24 December 2009; in revised form: 28 January 2010 / Accepted: 1 February 2010 / Published: 9 February 2010
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Sensors 2010, 10(1), 456-474; doi:10.3390/s100100456
Received: 10 December 2009; in revised form: 24 December 2009 / Accepted: 28 December 2009 / Published: 7 January 2010
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Sensors 2010, 10(1), 167-175; doi:10.3390/s100100167
Received: 21 October 2009; in revised form: 14 December 2009 / Accepted: 22 December 2009 / Published: 28 December 2009
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Sensors 2009, 9(12), 10201-10216; doi:10.3390/s91210201
Received: 9 November 2009; in revised form: 7 December 2009 / Accepted: 10 December 2009 / Published: 16 December 2009
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Sensors 2009, 9(11), 9300-9331; doi:10.3390/s91109300
Received: 4 August 2009; in revised form: 8 October 2009 / Accepted: 12 November 2009 / Published: 19 November 2009
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Sensors 2009, 9(11), 9104-9121; doi:10.3390/s91109104
Received: 26 August 2009; in revised form: 4 November 2009 / Accepted: 5 November 2009 / Published: 17 November 2009
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Sensors 2009, 9(11), 8748-8760; doi:10.3390/s91108748
Received: 30 July 2009; in revised form: 19 October 2009 / Accepted: 26 October 2009 / Published: 30 October 2009
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Sensors 2009, 9(11), 8473-8489; doi:10.3390/s91108473
Received: 6 August 2009; in revised form: 12 September 2009 / Accepted: 12 October 2009 / Published: 27 October 2009
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Sensors 2009, 9(10), 8349-8376; doi:10.3390/s91008349
Received: 29 July 2009; in revised form: 28 August 2009 / Accepted: 21 September 2009 / Published: 21 October 2009
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Sensors 2009, 9(10), 7970-7987; doi:10.3390/s91007970
Received: 5 August 2009; in revised form: 22 September 2009 / Accepted: 24 September 2009 / Published: 12 October 2009
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Sensors 2009, 9(10), 7988-8006; doi:10.3390/s91007988
Received: 30 July 2009; in revised form: 15 September 2009 / Accepted: 16 September 2009 / Published: 12 October 2009
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Sensors 2009, 9(8), 6219-6231; doi:10.3390/s90806219
Received: 29 June 2009; in revised form: 25 July 2009 / Accepted: 3 August 2009 / Published: 6 August 2009
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Sensors 2009, 9(8), 6200-6218; doi:10.3390/s90806200
Received: 30 June 2009; in revised form: 27 July 2009 / Accepted: 3 August 2009 / Published: 5 August 2009
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Sensors 2009, 9(5), 3854-3874; doi:10.3390/s90503854
Received: 27 March 2009; in revised form: 23 April 2009 / Accepted: 13 May 2009 / Published: 20 May 2009
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Sensors 2009, 9(3), 2062-2075; doi:10.3390/s90302062
Received: 19 February 2009; in revised form: 14 March 2009 / Accepted: 18 March 2009 / Published: 18 March 2009
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Last update: 4 March 2014

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